Electronic PCB Production Gas Detection Solution: Applications and Practices of the Nexisense SGA-500 Series
Electronic PCB manufacturing involves multiple precision processes, from substrate cleaning and coating to SMT placement soldering and reflow oven curing. Each step may release volatile organic compounds (VOCs), solvent vapors, or soldering fumes. If these gases are not effectively controlled, they not only threaten operators’ respiratory health but may also trigger flash fire risks, equipment corrosion, or environmental compliance issues. As regulations such as RoHS and REACH become increasingly stringent and factories transition toward intelligent manufacturing, real-time online gas monitoring has become a core element of production line safety and quality management.

The Nexisense SGA-500 series online gas concentration detector is designed specifically to address pain points in the electronics industry. It integrates original imported electrochemical and PID photoionization sensors. After secondary development using infrared gas mixing instruments, high-precision analyzers, and constant temperature and humidity calibration equipment, accuracy reaches ±5%FS, with a T90 response time of less than 15 seconds. Full-range temperature and humidity compensation and signal amplification circuits ensure stable data even in high-humidity cleanrooms or high-temperature soldering zones. The product adopts industrial-grade intrinsically safe circuit design and complies with Ex d IIC T6 Gb explosion-proof standards, suitable for deployment in Zone 1 and Zone 2 hazardous areas. It is ready for use upon power-up without on-site calibration. When concentration exceeds preset thresholds, it automatically triggers alarms and outputs relay signals, supporting linkage with fans, exhaust valves, or sprinkler systems.
Nexisense emphasizes system compatibility, supporting Modbus RTU, 4-20mA output, and RS-485 bus communication for seamless integration with PLC, SCADA, or MES platforms. Combined with the SGA-800 series alarm controller, it enables unified power supply, centralized display, and remote management for multiple points. This article starts from typical process risks and combines selection logic, integration essentials, and real-world cases to provide a practical reference path for EMS factories and SMT workshops.
Gas Risks and Monitoring Requirements in PCB Production Processes
Gas risks in PCB manufacturing are mainly concentrated in several key processes. During the cleaning stage, solvents such as isopropanol (IPA) and acetone are used to remove flux residues and grease. These volatile solvent vapors can easily accumulate, forming lower explosive limit (LEL) risks or causing long-term low-concentration exposure effects on the nervous system. Screen printing and solder mask coating processes release formaldehyde, benzene series compounds, and other VOCs. During soldering and reflow oven stages, thermal decomposition of flux produces rosin aldehydes and mixed VOC fumes, with peak concentrations often exceeding OSHA PEL thresholds, potentially causing occupational asthma or eye irritation.
In cleanrooms or lead-free soldering production lines, abnormal oxygen concentration may also affect solder joint quality. Certain older equipment that volatilizes residual solvents such as trichloroethylene requires special attention. Nexisense SGA-500 has been verified to cover mainstream gases: isopropanol (0-2000ppm PID range), acetone (0-5000ppm), formaldehyde (0-10ppm electrochemical), total VOCs (PID broadband), and supports composite channel configuration.
An EMS factory in South China deployed the SGA-500 PID module in the reflow oven area to monitor soldering fumes VOCs in real time. When concentration approached the 10ppm threshold, local exhaust ventilation was automatically activated, reducing peak concentration by more than 60%. Operators reported significantly improved breathing comfort. The solution complies with GBZ 2.1 occupational exposure limits and provides data support for ISO 45001 occupational health systems.
Gas Detector Selection Guide: Matching Process and Environment
Selection should consider four dimensions: gas type, concentration range, installation environment, and system interface. The Nexisense SGA-500 offers flexible configurations to avoid shortcomings of generic products in selectivity or anti-interference performance.
For solvent cleaning areas, prioritize PID sensors for broadband VOC monitoring (dominated by isopropanol and acetone), range 0-2000ppm, resolution 0.1ppm, suitable for capturing dynamic peaks. For reflow ovens and wave soldering areas, electrochemical formaldehyde + PID composite modules are recommended, with thresholds set at 0.3-0.75ppm (reference ACGIH TLV), ensuring controllable flux decomposition products. For lead-free processes concerned about oxidation defects, select electrochemical oxygen modules (0-25%VOL).
Environmental factors determine protection levels: cleanrooms prioritize IP65 stainless steel housing with anti-corrosion coating; high-temperature and dusty soldering areas recommend adding sampling pumps and pre-filters. Response time should meet T90<20 seconds to match production line rhythm. Nexisense calibration is NIST traceable, with zero drift <±1%FS/month.
Budget and scale orientation: single-point basic versions are suitable for small SMT lines; advanced versions support LoRa wireless networking for distributed deployment across multiple workshops. ROI analysis shows that reduced occupational health claims and downtime allow average cost recovery within 18 months.
System Integration Considerations: Ensuring Reliable Interlocking
Integration is the key to implementation. The SGA-500 open architecture lowers compatibility barriers, but attention must be paid to communication, power supply, and linkage details.
Communication configuration: 4-20mA loop load <500Ω, Modbus RTU 9600bps suitable for Siemens/Omron PLC polling; wireless extension uses Zigbee with transmission distance >500m, encryption compliant with IEC 62443. Alarm output dry contact (30VDC/2A), thresholds support dual-level alarms + 5%FS hysteresis, linking exhaust fans or MES alarm push notifications.
Unified 24VDC power supply (ripple <100mV), single-unit consumption <3W, PoE optional to reduce wiring. RS-485 bus uses AWG22 shielded cable, maximum 1200m, with surge protection to prevent electrostatic interference. Ground loops resolved using isolated converters.
Software provides configuration tools supporting batch parameter distribution and OPC UA data export. When integrated with MES, RESTful API pushes concentration trends for anomaly traceability. FAT/SAT testing includes EMC interference and long-term stability verification, ensuring uptime >99%.
These measures transform the system from independent monitoring to closed-loop production line control, with integration cycles typically shortened to within 10 days.
OEM Customization and Mass Supply Advantages
Nexisense focuses on B2B and provides flexible OEM services. Sensor modules can be embedded into customer cabinets or AOI equipment, supporting LOGO printing and protocol expansion (such as EtherNet/IP), MOQ 50 units, delivery time 4 weeks.
Parameter customization includes range adjustment, preset alarm logic, probe length modification. Orders over 500 units enjoy tiered discounts. Annual production capacity exceeds 10,000 units with high localized supply chain ratio. Logistics FOB Shenzhen with ATEX/IECEx certificates attached.
An EMS enterprise in the Pearl River Delta customized VOCs + oxygen dual-channel instruments via OEM integration into reflow oven control panels, successfully winning European automotive electronics projects and significantly enhancing competitiveness.
Project Application Cases
A precision electronics factory in Guangdong deployed SGA-500 PID + formaldehyde composite monitoring in reflow oven areas, integrated with Rockwell PLC, linking exhaust and sound-light alarms. Soldering fume peaks were controlled below 5ppm, and abnormal occupational health check rates decreased by 35%.
A Jiangsu watch electronics assembly line adopted wireless networking covering cleaning and screen printing areas. Data were centralized via SGA-800 controllers, achieving workshop-level unified management. VOC emissions met local environmental limits, and annual fine risk dropped to zero.
A Shenzhen SMT subcontracting factory deployed across multiple production lines. Combined with MES trend analysis, abnormal flux consumption was predicted, optimizing process parameters and reducing solder joint defect rates by 12%.
These cases demonstrate short integration cycles, strong compatibility, and proven reliable value of Nexisense in the electronics industry.
Frequently Asked Questions
1. What gases are mainly monitored in the PCB industry by the Nexisense SGA-500 series?
It primarily covers isopropanol, acetone, formaldehyde, total VOCs, oxygen, etc. PID is suitable for broadband solvent and soldering fume monitoring, while electrochemical modules target specific toxic gases such as formaldehyde with high selectivity. Composite channels are supported and can be customized based on flux type and solvent formulation.
2. How to determine detection points and ranges according to production processes?
Cleaning areas use single or dual points near exhaust outlets, range 0-2000ppm IPA/acetone. Reflow oven areas recommend multi-point sampling (furnace inlet + exhaust duct), VOCs 0-1000ppm or formaldehyde 0-10ppm. Nexisense provides CFD simulation suggestions to avoid dead zones.
3. How to ensure sensor lifespan and accuracy in high-temperature dusty soldering environments?
Built-in temperature and humidity compensation plus pre-filter sampling heads ensure drift <±2%FS/year near 150°C environments. Quarterly zero calibration using dedicated kits is recommended. Typical lifespan: PID 2-3 years, electrochemical 3-5 years. Remote health diagnostics provide early warnings.
4. What are the OEM MOQ and lead times?
MOQ 50 units. Supports housing embedding, protocol development, and display customization. Standard range/threshold adjustments 4 weeks; deep firmware development 6-8 weeks, with NDA protection and prototype verification.
5. How to reduce cross-interference between soldering fumes and solvent vapors?
PID broadband sensors combined with algorithm compensation. Formaldehyde electrochemical modules use dedicated filter layers, with interference from common VOCs <8%. Factory multi-component cross-test reports support software correction to ensure accuracy in composite scenarios.
6. Steps and considerations for integration into existing PLC or MES systems?
Protocol mapping – communication testing – linkage commissioning – SAT validation. Use isolated RS-485 to prevent loops. Bus repeaters extend distance. Nexisense provides Modbus templates and OPC UA configuration files to shorten integration time.
7. Certifications and logistics for bulk purchases?
Includes ATEX/IECEx, CNEx explosion-proof certificates, and CE/RoHS declarations. FOB Shenzhen standard. Orders over 500 units prioritized. Global sea/air freight supported with serial number management and customs documentation.
8. How to implement routine and predictive maintenance?
Monthly inspection in the first month, then quarterly zero/span calibration. Built-in diagnostics monitor baseline drift and sensitivity attenuation. When health index <80%, Modbus pushes early warnings to support preventive replacement. Unplanned maintenance reduced by 40% in actual projects.
Conclusion
The Nexisense SGA-500 series, centered on high precision, strong anti-interference capability, and easy integration, provides a full-chain gas safety solution from sensing to interlocking control for electronic PCB production. In the SMT era where VOCs and soldering fume risks are prominent, it helps factories enhance occupational health levels, ensure process stability, and meet environmental compliance requirements. In the future, combined with AI edge analytics, monitoring will become more predictive and intelligent. EMS and PCB manufacturing teams are welcome to contact Nexisense, share production line layouts and gas lists, and we will provide targeted POC solutions.
